Worldwide manufacturer of ultrahigh precision die attach equipment specializing in submicron placement accuracy (0.2 microns at 3 s). Provides die attach and flip chip bonders with focus on: opto, silicon photonics, AOC, VCSEL, laser diode, WLP, 2.5D/3D IC, TSV, TCB, fanout/EWLP, automotive sensors/lidar and MTB for advanced LED displays.
Established: 2001
Ownership type: Publicly Traded Stock